We perform accelerated thermal shock testing using a Sun Electronics System Rev. B chamber with direct CO₂ injection and ramp control via a Sun PC1000 controller. This system generates extremely fast temperature drops, far exceeding the ramp rates of any conventional system. Abrupt temperature changes make it possible to evaluate the stability of the material under mechanical stresses caused by sudden contraction, differential stresses and accelerated volumetric changes.
This type of test is ideal for identifying microcracks in resins, solder joint detachment, failures in encapsulation, internal cracks in cables, plastic deformation or loss of electrical continuity. Profiles can be programmed to run automatically, repeat hundreds or thousands of cycles and simulate events that would normally occur over months of real operation.
A significant advantage is the use of a Hioki recorder capable of acquiring data at up to 20 MS/s. This speed is sufficient to capture thermal transients, abrupt resistance jumps, current spikes caused by sudden contraction, or micro-failures that appear during thermal shock. Thanks to its high sampling rate, we can detect events that other laboratories could not see, such as microsecond electrical instabilities, brief disturbances or transient signals that indicate the onset of an imminent failure.
In addition, we provide a complete record of each cycle, photographs at different moments of the test, video of the process, trend analysis and detailed technical observations. This gives the customer complete, traceable evidence of how their component behaves under extreme conditions. The combination of rapid thermal shock with 20 MS/s data acquisition makes this service a powerful tool for accelerated reliability evaluation.
In all of our environmental analyses and laboratory tests where temperature is a critical parameter, we guarantee metrological control through in-house verification of our thermal systems. Each test is backed by temperature validation using our dry-block calibrator, with an operating range of -30 °C to 150 °C, resolution of 0.01 °C, thermal stability of ±0.02 °C and display accuracy of ±0.1 °C. We also evaluate block uniformity (horizontal ≤ ±0.05 °C) and the controlled vertical gradient, which ensures that measurements remain within the established uncertainties. This approach allows us to confirm the stability, uniformity and accuracy of the test conditions, providing reliable, traceable and technically supported results. The expanded uncertainty of the system is determined as a function of the operating point, the sensor under test and the process conditions.
